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GaN Blue/Green LED Epitaxial Materials & Chips
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    Limpex cooperates with the manufacturer to supply GaN Blue/Green LED Epitaxial Materials & Chips. This manufacturer mainly keeps research, production, sales of GaN base blue, green series high quality LED (Light Emitting Diodes) epitaxial materials & chips. It has international leading technology R&D abilities & mature production process. It has multiple core patents on LED field, and core advanced technologies on III nitride base high performances LED luminescent tube's materials growth, devices design and production manufacturing. It has factory area 106,000 square meters, its 1st fixed assets investment is RMB150,000,000 in a 7,000 square meters building, including MOCVD complete set of LED epitaxial & chips production line. The all properties of its blue & green LED chips for signboard display screen, and the lightness, service life of blue LED chips for white light are all listed in domestic advanced level, with output capacity 10,000pcs 2" LED epitaxial at the moment. The 2nd investment is in fulfilling now.


Blue LED Chip For Signboard Display Screen
Blue LED Chip
For Signboard Display Screen		 Blue LED Chip For White Light
Blue LED Chip
For White Light 		LED Epitaxial Chips Factory
LED Epitaxial Chips Factory
-
Blue LED Chip, 11mil ITO B1111IA, For House Signboard Display Screen
Blue LED Chip
11mil ITO B1111IA
For House Signboard Display Screen		 Green LED Chip, 11mil ITO G1111IA, For House Signboard Display Screen
Green LED Chip
11mil ITO G1111IA
For House Signboard Display Screen		 Blue LED Chip, 12mil NI/Au B1212TA, For House Outdoor Signboard Display Screen
Blue LED Chip
12mil NI/Au B1212TA
For House/Outdoor Signboard Display Screen
Green LED Chip, 12mil NI/Au G1212TA, For House Outdoor Signboard Display Screen
Green LED Chip
12mil NI/Au G1212TA
For House/Outdoor Signboard Display Screen		 Green LED Chip, 14mil NI/Au G1414TA, For Outdoor Signboard Display Screen
Green LED Chip
14mil NI/Au G1414TA
For Outdoor Signboard Display Screen		 Blue LED Chip, 14mil NI/Au B1414TA, For Outdoor Signboard Display Screen
Blue LED Chip
14mil NI/Au B1414TA
For Outdoor Signboard Display Screen
Blue LED Roughening Chip, 12mil ITO B1212IA, For White Light
Blue LED Roughening Chip
12mil ITO B1212IA
For White Light		 Blue LED Roughening Chip, 14mil ITO B1414IA, For White Light
Blue LED Roughening Chip
14mil ITO B1414IA
For White Light		  

Blue LED Chip for Signboard (HC-B1111IA)

Characteristics
Chip Description (um)
  • High-brightness and high-reliability
  • 100% Tested & Sorted
  • ESD100% Tested (500V HBM)
  • ITO Contact
Blue LED Chip, 11mil ITO B1111IA, For House Signboard Display Screen
Blue LED Chip
11mil ITO B1111IA
For House Signboard Display Screen
Chip Structure

Item

Content

Structure

Substrate

Sapphire

Emitting Layer

InGaN/GaN MQW

Bonding Pad

P-pad

Al pad

N-pad

Al pad

Chip Size

Size

280um×280um

Thickness

85±5um

Optical & Electrical Characteristics(T=25℃)

Item

Symbol

Test Condition

Number

Unit

Min.

Max.

Forward Voltage

Vf

@20mA

3.0

3.4

V

Dominant Wavelength

Wd

@20mA

465.0

467.5

nm

467.5

470.0

470.0

472.5

472.5

475.0

Leakage Current

Ir

@-10V

-

0.5

mA

Luminous Intensity

Iv

@20mA

80

90

mcd

90

100

100

110

110

120

120

130

130

140

140

150

Remarks:

  • Storage conditions such as temperature in the range of 25±5℃, and RH% of 30~60% are suggested.
  • The product is sensitive to ESD damage (classified as Level I).

Green LED Chip for Signboard(HC-G1111IA)

Characteristics
Chip Description (um)
  • High-brightness and high-reliability
  • 100% Tested & Sorted
  • ESD100% Tested (500V HBM)
  • ITO Contact
Green LED Chip, 11mil ITO G1111IA, For House Signboard Display Screen
Green LED Chip
11mil ITO G1111IA
For House Signboard Display Screen
Chip Structure

Item

Content

Structure

Substrate

Sapphire

Emitting Layer

InGaN/GaN MQW

Bonding Pad

P-pad

Al pad

N-pad

Al pad

Chip Size

Size

280um×280um

Thickness

85±5um

Optical & Electrical Characteristics (T=25℃)

Item

Symbol

Test Condition

Number

Unit

Min.

Max.

Forward Voltage

Vf

@20mA

3.0

3.4

V

Dominant Wavelength

Wd

@20mA

515.0

517.5

nm

517.5

520.0

520.0

522.5

522.5

525.0

525.0

527.5

527.5

530.0

Leakage Current

Ir

@-10V

-

0.5

mA

Luminous Intensity

Iv

@20mA

200

220

mcd

220

240

240

260

260

280

280

300

300

330

330

360

Remarks:

  • Storage conditions such as temperature in the range of 25±5℃, and RH% of 30~60% are suggested.
  • The product is sensitive to ESD damage (classified as Level I).

Blue LED Chip for Signboard (HC-B1212TA）

Characteristics
Chip Description (um)
  • High-brightness and high-reliability
  • 100% Tested & Sorted
  • ESD100% Tested (500V HBM)
  • Ni/Au Contact
Blue LED Chip, 12mil NI/Au B1212TA, For House Outdoor Signboard Display Screen
Blue LED Chip
12mil NI/Au B1212TA
For House/Outdoor Signboard Display Screen
Chip Structure

Item

Content

Structure

Substrate

Sapphire

Emitting Layer

InGaN/GaN MQW

Bonding Pad

P-pad

Al pad

N-pad

Al pad

Chip Size

Size

300um×300um

Thickness

85±5um

Optical & Electrical Characteristics (T=25℃)

Item

Symbol

Test Condition

Number

Unit

Min.

Max.

Forward Voltage

Vf

@20mA

3.0

3.4

V

Dominant Wavelength

Wd

@20mA

465.0

467.5

nm

467.5

470.0

470.0

472.5

472.5

475.0

Leakage Current

Ir

@-10V

-

0.5

mA

Luminous Intensity

Iv

@20mA

80

90

mcd

90

100

100

110

110

120

120

130

130

140

140

150

Remarks:

  • Storage conditions such as temperature in the range of 25±5℃, and RH% of 30~60% are suggested.
  • The product is sensitive to ESD damage (classified as Level I).

Green LED Chip for Signboard (HC-G1212TA)

Characteristics
Chip Description (um)
  • High-brightness and high-reliability
  • 100% Tested & Sorted
  • ESD100% Tested (500V HBM)
  • Ni/Au Contact
Green LED Chip, 12mil NI/Au G1212TA, For House Outdoor Signboard Display Screen
Green LED Chip
12mil NI/Au G1212TA
For House/Outdoor Signboard Display Screen
Chip Structure

Item

Content

Structure

Substrate

Sapphire

Emitting Layer

InGaN/GaN MQW

Bonding Pad

P-pad

Al pad

N-pad

Al pad

Chip Size

Size

300umm*300umm

Thickness

85±5um

Optical & Electrical Characteristics(T=25℃)

Item

Symbol

Test Condition

Number

Unit

Min.

Max.

Forward Voltage

Vf

@20mA

3.0

3.4

V

Dominant Wavelength

Wd

@20mA

515.0

517.5

nm

517.5

520.0

520.0

522.5

522.5

525.0

525.0

527.5

527.5

530.0

Leakage Current

Ir

@-10V

-

0.5

mA

Luminous Intensity

Iv

@20mA

200

220

mcd

220

240

240

260

260

280

280

300

300

330

330

360

Remarks:

  • Storage conditions such as temperature in the range of 25±5℃, and RH% of 30~60% are suggested.
  • The product is sensitive to ESD damage (classified as Level I).

Blue LED Chip for Signboard (HC-B1414TA)

Characteristics
Chip Description (um）
  • High-brightness and high-reliability
  • 100% Tested & Sorted
  • ESD100% Tested (500V HBM)
  • Ni/Au Process
Blue LED Chip, 14mil NI/Au B1414TA, For Outdoor Signboard Display Screen
Blue LED Chip
14mil NI/Au B1414TA
For Outdoor Signboard Display Screen
Chip Structure

Item

Content

Structure

Substrate

Sapphire

Emitting Layer

InGaN/GaN MQW

Bonding Pad

P-pad

Al pad

N-pad

Al pad

Chip Size

Size

300um×300um

Thickness

85±5um

Optical & Electrical Characteristics(T=25℃)

Item

Symbol

Test Condition

Number

Unit

Min.

Max.

Forward Voltage

Vf

@20mA

3.0

3.4

V

Dominant Wavelength

Wd

@20mA

465.0

467.5

nm

467.5

470.0

470.0

472.5

472.5

475.0

Leakage Current

Ir

@-10V

-

0.5

mA

Luminous Intensity

Iv

@20mA

80

90

mcd

90

100

100

110

110

120

120

130

130

140

140

150

Remarks:

  • Storage conditions such as temperature in the range of 25±5℃, and RH% of 30~60% are suggested.
  • The product is sensitive to ESD damage (classified as Level I).

Green LED Chip for Signboard (HC-G1414TA）

Characteristics
Chip Description (um）
  • High-brightness and high-reliability
  • 100% Tested & Sorted
  • ESD100% Tested (500V HBM)
  • Ni/Au Contact
Green LED Chip, 14mil NI/Au G1414TA, For Outdoor Signboard Display Screen
Green LED Chip
14mil NI/Au G1414TA
For Outdoor Signboard Display Screen
Chip Structure

Item

Content

Structure

Substrate

Sapphire

Emitting Layer

InGaN/GaN MQW

Bonding Pad

P-pad

Al pad

N-pad

Al pad

Chip Size

Size

300um×300um

Thickness

85±5um

Optical & Electrical Characteristics (T=25℃)

Item

Symbol

Test Condition

Number

Unit

Min.

Max.

Forward Voltage

Vf

@20mA

3.0

3.4

V

Dominant Wavelength

Wd

@20mA

515.0

517.5

nm

517.5

520.0

520.0

522.5

522.5

525.0

525.0

527.5

527.5

530.0

Leakage Current

Ir

@-10V

-

0.5

mA

Luminous Intensity

Iv

@20mA

200

220

mcd

220

240

240

260

260

280

280

300

300

330

330

360

Remarks:

  • Storage conditions such as temperature in the range of 25±5℃, and RH% of 30~60% are suggested.
  • The product is sensitive to ESD damage (classified as Level I).

Blue LED Chip for White（HC-B1212IA)

Characteristics
Chip Description (um）
  • High-brightness and high-reliability
  • 100% tested & sorted
  • ITO transparent electrode process
Blue LED Roughening Chip, 12mil ITO B1212IA, For White Light
Blue LED Roughening Chip
12mil ITO B1212IA
For White Light

Structure

Item

Content

Structure

Substrate

Sapphire

Emitting Layer

InGaN/GaN MQW

Bonding Pad

P-pad

Al pad

N-pad

Al pad

Chip Size

Size

300um×300um

Thickness

85±5um

Optical & Electrical Characteristics (T=25℃)

Item

Symbol

Test Condition

Number

Unit

Min.

Max.

Forward Voltage

Vf

@20mA

2.9

3.1

V

3.1

3.3

3.3

3.5

Dominant Wavelength

Wd

@20mA

455.0

457.5

nm

457.5

460.0

460.0

462.5

462.5

465.0

Leakage Current

Ir

@-10V

-

0.5

mA

Luminous Intensity

Iv

@20mA

80

100

mcd

100

120

120

140

140

170

170

200

200

—

Remarks:

  • The above photoelectric parameters are tested in room temperature with the manufacturer's testing instruments.
  • Storage time and environment temperature & humidity will influence the quality of chips, the encapsulation packaging temperature could not exceed 280℃.
  • GaN LED chip's static class is I, so static protection should be considered during usage & transportation.
  • Customerized special specifications chips are available.

Blue LED Chip for White（HC-B1414IA）

Characteristics
Chip Description (um）
  • High-brightness and high-reliability
  • 100% tested & sorted
  • ITO contact
Blue LED Roughening Chip, 14mil ITO B1414IA, For White Light
Blue LED Roughening Chip
14mil ITO B1414IA
For White Light
Structure

Item

Content

Structure

Substrate

Sapphire

Emitting Layer

InGaN/GaN MQW

Bonding Pad

P-pad

Al pad

N-pad

Al pad

Chip Size

Size

350um×350um

Thickness

85±5um

Optical & Electrical Characteristics (T=25℃)

Item

Symbol

Test Condition

Number

Unit

Min.

Max.

Forward Voltage

Vf

@20mA

2.9

3.1

V

3.1

3.3

3.3

3.5

Dominant Wavelength

Wd

@20mA

455.0

457.5

nm

457.5

460.0

460.0

462.5

462.5

465.0

Leakage Current

Ir

@-10V

-

0.5

mA

Luminous Intensity

Iv

@20mA

80

100

mcd

100

120

120

140

140

170

170

200

200

—

Remarks:

  • Storage conditions such as temperature in the range of 25±5℃, and RH% of 30~60% are suggested.
  • The product is sensitive to ESD damage (classified as Level I).

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